Wedge bonder (웨지본더)
- Manufacturer Kulicke & Soffa Industries Inc
- Manufacture date 2013
- Model model-4526
- Location IBS Headquarter C187 Microscope lab
- Manager None
PURPOSE
Wire-bonding is a method to make an electrical connection between a silicon die and a package lead in a microelectronic device.
SPECIFICATION AND PERFORMANCE
- Full manual mode
- Niobium (annealed) Aluminum and gold wire available
- 90 degree clamp and spool for deep access
- Heater stage and temperature controller