Manual Die Bonder (수동 다이 본더)
- Manufacturer TPT
- Manufacture date
2017
- Model HD10
- Location IBS Headquarter C187 Microscope lab
- Manager None
PURPOSE
- Sensor assemply for low temperature detector
- The epoxy can be pasted through epoxy stamping or exoxy dispensing
SPECIFICATION AND PERFORMANCE
- Pick up tool and vacuum pump for pic and place
- Dual head for die-placement and for epoxy stamping
- Motorized and programmable Z-axis: > 10mm
- Bond force range: 10 ~ 150cN
- Bond time range: 1 ~ 20000 sec
- Heating temperature control: 0 ~ 120 ℃
