Facilities and Equipment

This equipment is used to measurement for low temperature detectors. It is an automatic dicing saw for ø6-inch wafers with small footprint.

• Automatic dicing saw for ø 6-inch wafers
  • 150 mm square workpiece support can be added via a user-specified specification.
• Offering the world’s smallest space-saving footprint
  • W: 490 mm
  • D: 870 mm
  • H: 1,600 mm
  • This advantage is especially apparent when multiple units are used in parallel (improved productivity per unit area).
• Improved throughput :
  • Improved speed for the X, Y, and Z-axis.
    * Maximum speed of the X-axis improved to 700 m/s (Increased by about 1.4x compared to the existing DAD322).
  • Incorporation of a high performance processor
  • Screen transition time and software operation speed have been greatly improved.
• High torque 2.0 kW spindle installed
  • Supports the processing of difficult-to-cut materials including glass and ceramics
  • A high rotation speed 1.8 kW spindle is also available as an option (max rotation speed: 60,000 min-1).
• Further evolution for improved user friendliness
  • Increased operation monitor size (Current: 10.4 inches →15 inches) for improved visual recognition and an increase in the amount of displayable information.